Automotive News – Electrical Engineering Electronics News

Stay updated with the latest advancements in automotive electronic and electrical engineering. This article delves into the transformative innovations shaping the industry.

From novel core materials to advanced microcontrollers, explore the cutting-edge technologies driving the future of automotive systems and infrastructure.

Innovative Core Material in TDK’s Inductive Chokes

The introduction of a novel alloy powder core material has revolutionized TDK’s inductive chokes. This material provides superior saturation properties, pushing the boundaries of current density. Such advancements ensure that high-current chokes can handle greater loads, benefiting multiple electrical applications. TDK’s development showcases the potential of new materials in enhancing electronic component performance.

Keysight’s Portable 14-bit ADC Oscilloscope

Keysight recently unveiled a portable 14-bit ADC oscilloscope designed for general applications. This oscilloscope combines architectural improvements and software support to offer higher resolution, real-time processing, and enhanced signal analysis. It represents a significant step forward in measurement technology, providing users with more precise data interpretation capabilities.

Enhancements in Nuvoton’s MCU Series

The M2003 series from Nuvoton has been upgraded to 32 bits to bolster smart home systems. Featuring an Arm Cortex-M23 core, these microcontrollers now offer enhanced system performance. The compact 20-pin package makes them ideal for space-constrained applications. This enhancement underscores Nuvoton’s commitment to advancing smart home technology.

Omron’s High-Power PCB Relay for EV Charging

Omron has introduced a 4-pole relay that fits onto a PCB to manage high-power charging in electric vehicle (EV) wallboxes. This relay is designed to reduce the heat generated during three-phase power delivery, enhancing the efficiency and safety of EV charging systems. By mitigating heat production, Omron’s relay contributes to more reliable and durable EV charging infrastructure.

Toshiba’s Auto CXPI Responder Chip

Toshiba’s new Auto CXPI responder chip incorporates built-in logic hardware to facilitate low data-rate communication between Electronic Control Units (ECUs) within automotive networks. This chip simplifies network architecture and improves communication efficiency. The integration of this chip represents a step forward in automotive communication technology, enabling more streamlined vehicle networks.

Emerging Automotive Technologies

Three significant developments in automotive technology have been highlighted recently. Diodes Incorporated has introduced new redriver solutions to enhance signal integrity. Waymo has made strides in Advanced Driver Assistance Systems (ADAS), aiming to improve vehicle safety. Meanwhile, the transportation department has been advancing Vehicle-to-Everything (V2X) communication, enhancing connectivity between vehicles and infrastructure. These innovations are set to make driving safer and more connected.

Microchip’s EV Charger Designs

Microchip has announced a trio of reference designs for electric vehicle chargers, suitable for both residential and commercial use. These designs offer new features and improvements right out of the box, catering to the growing demand for efficient and accessible EV charging solutions. This release highlights Microchip’s dedication to advancing EV infrastructure, providing robust tools for charger design.

Efinix’s New FPGA Family

Efinix’s new Topaz FPGA line targets the mass market with high-performance, cost-effective chips. Building on the Titanium FPGA portfolio, these new chips are designed for mainstream applications, balancing performance and affordability. This launch signifies Efinix’s strategic move to capture a broader market share, providing versatile solutions for various industries.

Infineon’s Expanded Bluetooth MCU Lineup

Infineon has added eight new Bluetooth MCUs to its BLE 5.4 MCU family. These variants come in both System-on-Chip (SoC) and module configurations, catering to a wide range of industrial, consumer, and automotive applications. The expansion reflects Infineon’s commitment to providing diverse connectivity solutions, enhancing the capabilities of Bluetooth technology.

New MOSFETs from Industry Leaders

Nexperia, Toshiba, and Navitas have each expanded their MOSFET product lines, focusing on efficiency, thermal resistance, and compactness. These advancements are crucial in meeting the demands of modern electronic systems, where size, power, and heat management are critical. The introduction of these MOSFETs underscores the ongoing innovation in power electronics, aiming to deliver better performance in smaller packages.

Intel’s Automotive Discrete GPU Debut

Intel has entered the automotive sector with its new discrete GPU, designed to complement the SDV SoC. This integration allows automakers to handle larger compute workloads more efficiently. The debut is a significant milestone for Intel, marking its expansion into the automotive GPU market and providing new computational capabilities for vehicles.

Intelligent E-Fuses for Diverse Applications

New e-fuses from Toshiba, Nexperia, and STMicroelectronics are bringing intelligence to traditional fuse and circuit breaker roles. These e-fuses are versatile, catering to applications from laptops to vehicles and datacenters. This innovation represents a shift towards smarter electrical protection, enhancing safety and functionality across various sectors.

Microchip’s Latest dsPIC Enhancements

Microchip has upgraded its dsPIC line to operate at 200 MHz, the highest clock speed to date. The new line adds a double-precision floating-point unit and an enhanced DSP engine, offering significant performance improvements for digital signal processing applications. This upgrade highlights Microchip’s commitment to pushing the boundaries of microcontroller performance.

Chipmaker Collaborations in the Automotive Market

Leading chipmakers NXP, Infineon, MediaTek, and Onsemi are collaborating with automotive OEMs to advance the development of digital cockpits, traction inverters, and other systems. These partnerships are crucial for driving innovation and efficiency in automotive technology. Such collaborations exemplify the industry’s focus on cooperative development to meet the evolving needs of modern vehicles.

Onsemi’s Next-Gen SiC MOSFETs

Onsemi has unveiled next-generation Silicon Carbide (SiC) MOSFETs to address the rising global energy demands. These MOSFETs offer increased power density, making them essential for high-efficiency semiconductor applications. The launch underscores the importance of advanced materials in meeting future energy needs, providing robust solutions for various industries.

Updates in Image Sensor Portfolios

OmniVision, STMicroelectronics, and Onsemi have updated their image sensor portfolios to improve size, efficiency, and development ecosystems. These enhancements are tailored for applications ranging from augmented reality to factory automation. The updates highlight the continuous innovation in image sensing technology, aiming to deliver better performance across diverse applications.

Nuvoton’s Motor Driver IC for AI Data Centers

Nuvoton has introduced a 48-V direct drive motor driver IC to enhance efficiency, airflow, and speed rotation in fan motors for AI-laden data centers. This IC promotes high efficiency, crucial for managing the increased computational loads in data centers. The release is a testament to Nuvoton’s focus on high-performance solutions for advanced technological infrastructures.

Innovative Sensors Targeting Various Applications

Samsung, Sensry, and Melexis have announced new sensor technologies and collaborations aimed at enhancing performance, power, and protection in smartphones, industrial, and automotive designs. These innovations are poised to drive significant improvements in sensor technology. The collaborations reflect a strategic approach to advancing sensor capabilities, catering to diverse market needs.

Allegro’s Alternative Current Sensors

Allegro has introduced new current sensors that provide an alternative to traditional shunts by integrating more features. This integration reduces the need for external components, simplifying system design. The new sensors represent a leap forward in current sensing technology, offering more efficient solutions for modern electronics.

Toshiba’s New Switching Topology for DC-DC Converters

Toshiba has demonstrated a new switching topology for non-isolated DC-DC converters, eliminating the need for a transformer and reducing the number of capacitors significantly. This innovation simplifies the design and enhances the efficiency of DC-DC converters. It represents a significant advancement in power conversion technology, facilitating more compact and efficient designs.

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The automotive electronics and electrical engineering landscape is rapidly evolving with groundbreaking innovations.

These advancements promise enhanced performance, efficiency, and safety, paving the way for the next generation of automotive technology.

Source: Allaboutcircuits